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American Semiconductor, Inc.Report or remove this logo

American Semiconductor, Inc. Federal Contracts

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UEIUEI: the 12-character ID the government gives every company registered for federal work. It replaced the DUNS number in April 2022. Glossary C1BNR9HJBQK8· CAGECAGE code: a 5-character code that identifies one company location for federal work. A company with several sites can have several. Glossary 1WGA8· BOISE, ID· Active registration until Nov 12, 2026· www.americansemi.com (opens in a new tab)

Overview

Buyers and offices that award its prime contracts, US$, active FY2021–FY2026

Obligated since award on contracts active FY2021–FY2026

Click a company to open its profile.

Buyers (sub-agency)OfficesThis companyDepartmental Offices$1.68MDefense Health Agency$1.1MArmy$162KIBC ACQ SVCS DIRECTORATE (00004)(140D04)$1.68M · Departmental Offices officeARMY MED RES ACQ ACTIVITY (HT9425)$1.1M · Defense Health Agency officeW4PZ USA MED RSCH ACQUIS ACT(W81XWH)$162K · Army officeAmerican Semiconductor, Inc.$2.95M
Awards toSubcontracts toCircle area = dollars

Insight IBC ACQ SVCS DIRECTORATE (00004) (140D04) is its largest buyer. See more on the Buyers tab

3 buying offices

Prime contract obligationsObligation: money the government has legally committed to a contract. It is not the same as money paid. Example: $6M obligated of a $10M ceiling. Glossary, FY2002–FY2026

$13.4M

Includes FY2026 so far: $744K, still being reported

Subcontracts it received

$438K

from 1 prime

About

From the company's SBA profile, updated Nov 2025

American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.

Prime contract obligations by fiscal year, US$, FY2002–FY2026

Agencies report with a delay; the latest year will rise

Hover over a year to see its value.

FY02FY05FY07FY09$3.23MFY11FY14FY19FY22FY24FY26FY26 so far: $744K

Insight Largest year: $3.23M in FY2010; since FY2021, $940K in FY2025. See more on the Contracts tab

Prime obligations since award by state of performance, US$, contracts active FY2021–FY2026

$2.95M since award = $2.84M in FY2021–FY2026 + $108K before FY2021

Click a state to open its page.

AKMEVTNHWAIDMTNDMNILWIMINYRIMAORNVWYSDIAINOHPANJCTCAUTCONEMOKYWVVAMDDEAZNMKSARTNNCSCDCOKLAMSALGAHITXFLPR
  1. Idaho$2.95M · 100%
Circle area = dollarsOutlined: head office state (Idaho)

Insight 100% was performed in Idaho. See more on the Contracts tab