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Arcnano, Inc.Report or remove this logo

Arcnano, Inc. Federal Contracts

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UEIUEI: the 12-character ID the government gives every company registered for federal work. It replaced the DUNS number in April 2022. Glossary DXN7EFA9EAT3· CAGECAGE code: a 5-character code that identifies one company location for federal work. A company with several sites can have several. Glossary 34MA4· SAINT PAUL, MN· Active registration until May 29, 2027· www.arcnano.com (opens in a new tab)

Overview

Buyers and offices that award Arcnano prime contracts, US$, active FY2021–FY2026

Obligated since award on contracts active FY2021–FY2026

Click a company to open its profile.

Buyers (sub-agency)OfficesThis companyArmy$2MAir Force$1.35MW27P USA ACQ SPT CTR (W51701)$2M · Army officeFA9550 AFRL AFOSR$1.35M · Air Force officeArcnano, Inc.$3.34M
Awards toSubcontracts toCircle area = dollars

Insight W27P USA ACQ SPT CTR (W51701) is its largest buyer. See more on the Buyers tab

2 buying offices

Prime contract obligationsObligation: money the government has legally committed to a contract. It is not the same as money paid. Example: $6M obligated of a $10M ceiling. Glossary, FY2008–FY2026

$4.84M

Subcontracts it received

$78.5K

from 2 primes

About

From the company's SBA profile, updated Jun 2026

Science and Engineering Physics Modeling, CAD Design, Finite Element Analysis, SBIR Partnering, STTR Partnering, Government Contracting, Sub-Contracting for Mil/Aero Primes Wafer Fab Products and Services Wafer Scale Fabrication: MEMs, Sensors, Devices Thin Film Deposition: Sputtering, Evaporation, CVD, ALD, Plating Patterning: Mask Design, GDS2 Format, Suss Front Side Back Side Mask Aligner, Canon Stepper, Heidelberg Direct Write Etching: Wet Etch, Ion Milling, RIE, DRIE, Ion Milling Wafer to Package Back End: BEOL, Chip Stacking; 2.5D, 3D Devices, Flip Chip, Laser Die Attach to Heat Sink, Photonic and Opto-Electronic Devices Wafer Back End Bare Die: Wafer Thinning, Dicing, Pick Out to Tape or Chip Tray Ultra High Precision Machining Services CNC 3 Axis and 5 Axis Milling, Wire EDM, Micro EDM, Grinding, Lapping, CMP Typical materials include hard steels, ceramics, titanium, molybdenum, Tungsten, Tantalum, and more Analytical Services SEM, EDS, XRF, FIB, AFM, MFM, TEM

Prime contract obligations by fiscal year, US$, FY2008–FY2026

Agencies report with a delay; the latest year will rise

Hover over a year to see its value.

FY08FY09FY10FY11FY12FY13FY18FY20FY23FY24$2MFY25FY26$0 so far

Insight Largest year: $2M in FY2024. See more on the Contracts tab

Prime obligations since award by state of performance, US$, contracts active FY2021–FY2026

Click a state to open its page.

AKMEVTNHWAIDMTNDMNILWIMINYRIMAORNVWYSDIAINOHPANJCTCAUTCONEMOKYWVVAMDDEAZNMKSARTNNCSCDCOKLAMSALGAHITXFLPR
  1. Minnesota$3.34M · 100%
Circle area = dollarsOutlined: head office state (Minnesota)

Insight 100% was performed in Minnesota. See more on the Contracts tab